Discover published sets by community

Purpose: To cut the silicon ingot into thin disks. Method: Using a diamond saw or a wire saw. Equipment Used: Slicing machine, saws, coolant system.

Purpose: To produce single-crystal silicon ingots. Method: Czochralski process or Floating zone process. Equipment Used: Crystal puller, crucible, heater.

Purpose: To smoothen the wafer surfaces after slicing. Method: Abrasive mechanical process. Equipment Used: Lapping machine, abrasive slurry, polishing pads.

Purpose: To remove surface defects or damage layers. Method: Wet chemical etching or dry plasma etching. Equipment Used: Wet bench, etching solutions, plasma etcher.

Purpose: To deposit layers of materials on the wafer. Method: Chemical Vapor Deposition (CVD), Physical Vapor Deposition (PVD). Equipment Used: CVD reactor, PVD sputtering system, vacuum chamber.

Purpose: To transfer circuit patterns onto the wafer. Method: UV light exposure through a photomask. Equipment Used: Photoresist coater, exposure system, developer.

Purpose: To create a defect-free mirror finish on wafers. Method: Chemical Mechanical Planarization (CMP). Equipment Used: CMP machine, polishing slurry, pad conditioner.

Purpose: To change the electrical properties of the silicon wafer. Method: Ion implantation or diffusion. Equipment Used: Ion implanter, furnace (for diffusion), protective gases.

Purpose: To create electrical connections on the wafer. Method: Sputtering or evaporation. Equipment Used: Metal deposition system, vacuum chamber, masks.

Purpose: To ensure quality and performance of the wafers. Method: Visual inspection, electrical testing. Equipment Used: Microscope, electronic test equipment, defect inspection system.

Purpose: To cut the wafer into individual dies or chips. Method: Mechanical sawing, laser cutting, or plasma dicing. Equipment Used: Dicing saw, laser cutter, plasma dicing machine.