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Semiconductor Processing

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Dicing

Slices the finished wafer into individual semiconductor devices.

Physical Vapor Deposition (PVD)

Deposits thin films through a physical process.

Chemical Vapor Deposition (CVD)

Deposits thin films of material onto the semiconductor.

Planarization

Flattens the wafer surface for subsequent layers.

Oxidation

Grows a layer of silicon dioxide on the semiconductor surface.

Annealing

Heating process that repairs damage to the silicon crystal lattice.

Ion Implantation

Dopes the semiconductor with impurities to change its electrical properties.

Metallization

Forms metal interconnects on the semiconductor.

Photolithography

Used to transfer circuit patterns onto semiconductor wafers.

Etching

Removes selected areas from the surface of the semiconductor.

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